オンラインカジノおすすめランキング2024 年【人気定番 ...

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MENU Company Company Back Company Message from Top Management Our Founding Spirit Brand Statement Our Story Our History of Value Creation Vision and Strategy Framework Group Vision Long-Term Management Strategy Management Policy Medium-Term Management Plan Corporate Information and Business Sites Business Overview Introduction of Executives Corporate Governance Group Companies Procurement Policy Corporate Policy over Internal Control Integrated Report Products and Technology Products Back Products Search by Application Mobility Architectural Materials Infrastructure / General Industry Electronics Semiconductors Energy Daily commodities, Food industry Life Science Search by Business Category Architectural Glass Automotive Display Electronic Materials Essential Chemicals Performance Chemicals Life Science Ceramics New Business Search by Name Search by Keyword Technology and Innovation back Technology and Innovation A Message from the Chief Technology Officer Technology Development Strategy Intellectual Property Strategy R&D Structure Core Technologies Technology Highlights Mobility Electronics Life Science AGC Yokohama Technical Center AGC OPEN SQUARE “AO” Overview Facility Guide Access Collaboration Research Collaboration System R&D Library Measures to Prevent Misconduct in Research and Properly Manage Public Research Funds Sustainability Sustainability Back Sustainability Protecting the Global Environment and Utilizing Resources Supporting the Evolution of Cities and Mobility Realizing Longevity Society Where People Can Live in Good Health Creating a Healthy and Secure Society through Connections Generating New Value from Fair and Safe Workplaces Message from the President and CEO The AGC Group’s Sustainability Management Sustainability Promotion System Download Report Site Reports External Evaluations GRI Standards Index Sustainability-related policies, criteria, and guidelines AGC Group Code of Conduct/Compliance Help Lines Investors Investors Back Investors Management Information To Our Shareholders Vision and Strategy Framework Business Risks Disclosure Policy Financial Highlights IR News IR Library Company Overview Presentations of Financial Results Presentations of Business Briefings Financial Results Financial Review AGC Review (Newsletter for Shareholders) ESG Information Sustainability Corporate Governance Integrated Report Stock and Bond Information Stock Information Corporate Bond and Rating Information Dividend Information Analyst Coverage General Meeting of Shareholders Methods for Various Stock Procedures Electronic Public Notice Articles of Incorporation Stock Price Contact Us FAQ IR Email News Support Information IR Calendar Cautionary Statement IR Site Map Careers News Contact EN JP CN Search Glass substrate for semiconductor packaging Glass substrate for semiconductor packaging Glass substrate for packaging(mounting) of semiconductor Product Inquiries & Information Requests Product Inquiries & Information Requests This glass substrate is suitable as a carrier substrate for the process in semiconductor packaging. It is characterized by flatness and smoothness. The shape corresponds to wafers such as Φ300 mm or panel sizes such as 500 mm square. Applications Carrier glass for wafer level packaging Carrier glass for panel level packaging Features In recent years, the technology of packaging in a state of wafer (wafer level packaging) has become widespread, replacing the conventional packaging by individual piece. As a result, the needs are growing for glass as a carrier substrate in the packaging process of semiconductor. AGC offers a glass wafer and a glass panel which are high quality and easy to use. It supports a wafer size φ300 mm and others, and a panel size equivalent to 500 mm square and others. Additionally, it also supports the requirement of high flatness, high smoothness, notch, and ID marking. Features Support a wafer size with φ300mm and others, and a panel size equivalent to □500mm and others Support high flatness and high smoothness Support notch, serially numbering, and noncontact/contact packaging Product Inquiries & Information Requests Inquiry Form HomeProductsElectronic MaterialsGlass substrate for semiconductor packaging Products Search by Application Mobility Architectural Materials Infrastructure / General Industry Electronics Semiconductors Energy Daily commodities, Food industry Life Science Search by Business Category Architectural Glass Automotive Display Electronic Materials Essential Chemicals Performance Chemicals Life Science Ceramics New Business Search by Name Search by Keyword Check in AGC Site Map About Social Media Contact About This Site Privacy Policy ©AGC Inc.

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